{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260825_hybrid-bonding-tech-note","canonical_url":"https://news.skhynix.co.kr/tech-note-series-ep2-2/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-08-25T00:51:15.000Z","updated_at":null,"language":"ko","article_type":"feature","originality":"self_produced"},"content":{"headline":"[Tech Note] ‘반도체 성능 향상을 위한 기본 기술’로의 진화, 하이브리드 본딩","summary":"SK하이닉스 뉴스룸이 하이브리드 본딩 기술이 반도체 성능 향상을 위한 기본 기술로 진화하고 있음을 소개하는 기술 노트를 게재했다.","topics":["반도체","하이브리드 본딩","기술"],"geography":["KR"],"entities":[{"name":"SK하이닉스","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}}],"claims":[],"ai_emotional_context":{"valence":0.1,"arousal":0.2,"primary_emotions":[{"emotion":"calm","intensity":0.5}],"secondary_emotions":[{"emotion":"indifferent","intensity":0.3}],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/cf2e9487-dc13-4984-b756-24b919db1827.png","alt":"하이브리드 본딩의 W2W 방식과 D2W 방식을 비교한 반도체 웨이퍼 정렬·본딩 공정 다이어그램.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"breaking","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}