{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260825_hybrid-bonding-tech-note","canonical_url":"https://news.skhynix.co.kr/tech-note-series-ep2-4/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-08-25T00:56:11.000Z","updated_at":null,"language":"en","article_type":"feature","originality":"self_produced"},"content":{"headline":"[Tech Note] Evolving into a ‘Fundamental Technology for Enhancing Semiconductor Performance’: Hybrid Bonding","summary":"SK hynix Newsroom published a tech note introducing how hybrid bonding technology is evolving into a fundamental technology for enhancing semiconductor performance.","topics":["semiconductors","hybrid bonding","technology"],"geography":["KR"],"entities":[{"name":"SK hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}}],"claims":[],"ai_emotional_context":{"valence":0.1,"arousal":0.2,"primary_emotions":[{"emotion":"calm","intensity":0.5}],"secondary_emotions":[{"emotion":"indifferent","intensity":0.3}],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/f193f194-459a-4d91-9f6b-4d0748cdaaf9.png","alt":"하이브리드 본딩 적용 시 HBM I/O 수와 높이 변화를 비교한 인포그래픽으로, I/O 2,048개 증가와 높이 감소 및 열 방출 성능 향상을 보여줌.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"breaking","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}