{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260825_hybrid-bonding-tech-note","canonical_url":"https://news.skhynix.co.kr/tech-note-series-ep2-1/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-08-25T00:47:09.000Z","updated_at":null,"language":"en","article_type":"feature","originality":"self_produced"},"content":{"headline":"[Tech Note] Evolving into a 'Fundamental Technology for Enhancing Semiconductor Performance', Hybrid Bonding","summary":"SK Hynix Newsroom published a tech note introducing how hybrid bonding technology is evolving into a fundamental technology for enhancing semiconductor performance.","topics":["semiconductors","hybrid bonding","technology"],"geography":["KR"],"entities":[{"name":"SK Hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}}],"claims":[],"ai_emotional_context":{"valence":0.1,"arousal":0.2,"primary_emotions":[{"emotion":"calm","intensity":0.5}],"secondary_emotions":[{"emotion":"indifferent","intensity":0.3}],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/3b0824db-7a68-44fb-8997-0a1e6e9614ee.png","alt":"솔더 범프 100㎛, 마이크로 범프 20㎛, Cu-Cu 하이브리드 본딩 2㎛로 접촉 간격이 줄어드는 과정을 비교한 그림.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"breaking","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}