{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260525_ihbm-cooling-solution","canonical_url":"https://news.skhynix.co.kr/ihbm-solution/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"news.skhynix.co.kr","type":"online"},"author":"SK하이닉스","published_at":"2026-05-25T23:27:54.000Z","updated_at":null,"language":"en","article_type":"press_release_based","originality":"self_produced"},"content":{"headline":"SK Hynix Unveils 'iHBM' Memory Solution Technology to Curb Heat Generation… Enhancing AI System Efficiency","summary":"SK Hynix has unveiled 'iHBM' technology, which embeds an integrated cooling element into HBM packages to reduce thermal resistance by more than 30%. The company plans to apply the technology starting with next-generation HBM5, meeting the thermal management requirements of high-performance computing environments such as AI data centers.","topics":["semiconductors","memory","ai","technology"],"geography":["KR"],"entities":[{"name":"SK Hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":null,"parent":null}},{"name":"Lee Kang-wook","canonical_id":"person:kr:lee-kang-wook","type":"person","role_in_article":"quoted","metadata":{"ticker":null,"parent":null}},{"name":"HBM5","canonical_id":"product:kr:hbm5","type":"product","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}}],"claims":[{"id":"c1","statement":"SK Hynix unveiled 'iHBM' technology on the 26th, which embeds an integrated cooling element called 'ICE' into HBM packages to dramatically reduce heat generation","as_of":"2026-05-26","as_of_explicit":true,"as_of_raw":"the 26th","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c2","statement":"iHBM reduces thermal resistance by more than 30% compared to existing products","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"compared to existing products","source_type":"company_disclosure","comparison":"baseline_technology","type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c3","statement":"The company plans to apply iHBM technology starting with next-generation products such as HBM5","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"starting with next-generation products","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":null,"insight":null},{"id":"c4","statement":"Stable mass production is possible by applying the Advanced MR-MUF-based WLP process, which has already been proven in the market","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"already","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0,"arousal":0,"primary_emotions":[],"secondary_emotions":[],"emotional_triggers":[]}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}