{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20261014_3d-fenand-aim-research","canonical_url":"https://news.skhynix.co.kr/research-inside-ep2/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-10-14T00:00:03.000Z","updated_at":null,"language":"en","article_type":"feature","originality":"self_produced"},"content":{"headline":"[Research Inside] In the AI Era, NAND That Used to Store Data Has Begun to Compute∙∙∙ 3D FeNAND Co-optimization, Proven in an IEEE Paper, Opens a New Dimension of AI Memory","summary":"An SK hynix research team has developed a technology that co-optimizes cells, non-cell components, and pages to enhance the efficiency of 3D FeNAND-based analog computing-in-memory (A-CiM). Simulation results confirmed that throughput improved by approximately 10 to 20 times and energy efficiency by approximately 4,000 to 5,000 times compared to conventional two-dimensional arrays.","topics":["semiconductors","ai","memory","r&d"],"geography":["KR"],"entities":[{"name":"SK hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}},{"name":"IEEE","canonical_id":"org:us:ieee","type":"organization","role_in_article":"source","metadata":{"ticker":null,"parent":null}}],"claims":[{"id":"c1","statement":"Under limited chip size conditions, the throughput of 3D FeNAND-based A-CiM improved by approximately 10 to 20 times compared to conventional two-dimensional arrays","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":"2d_array_baseline","type":"fact","figures":{"value":10,"unit":"x","approximate":true,"converted":null},"expiry_hint":null,"insight":null},{"id":"c2","statement":"Under limited chip size conditions, the energy efficiency of 3D FeNAND-based A-CiM improved by approximately 4,000 to 5,000 times compared to conventional two-dimensional arrays","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":"2d_array_baseline","type":"fact","figures":{"value":4000,"unit":"x","approximate":true,"converted":null},"expiry_hint":null,"insight":null},{"id":"c3","statement":"When a low-resistance metal was applied to the wordline metal material, throughput improved by up to 16% and energy efficiency by up to 3% compared to the baseline structure","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":"baseline_structure","type":"fact","figures":{"value":16,"unit":"%","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c4","statement":"Applying an air gap to the oxide layer between wordlines can reduce parasitic capacitance by approximately 60%","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":null,"type":"fact","figures":{"value":60,"unit":"%","approximate":true,"converted":null},"expiry_hint":null,"insight":null},{"id":"c5","statement":"Applying an air gap to the oxide layer between wordlines resulted in a 1.2-fold improvement in throughput and a 2-fold improvement in energy efficiency","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":"baseline_structure","type":"fact","figures":{"value":1.2,"unit":"x","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c6","statement":"Co-optimizing wordline resistance and capacitance increased throughput by up to 1.4 times and energy efficiency by up to 2.2 times","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":"baseline_structure","type":"fact","figures":{"value":1.4,"unit":"x","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c7","statement":"Applying in-page pipelining (IPP) improved energy efficiency by 2 times and throughput by 9 times compared to the baseline structure","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":"baseline_structure","type":"fact","figures":{"value":9,"unit":"x","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c8","statement":"Applying page splitting improved energy efficiency by 1.2 times and throughput by 1.7 times","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":"baseline_structure","type":"fact","figures":{"value":1.7,"unit":"x","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c9","statement":"Stable 4-level-per-cell operation in the low-current region and reliable data retention characteristics were confirmed even at 300mm wafer scale","as_of":"2025","as_of_explicit":false,"as_of_raw":"2025 IEEE International Electron Devices Meeting (IEDM)","source_type":"research_paper","comparison":null,"type":"fact","figures":{"value":4,"unit":"levels/cell","approximate":false,"converted":null},"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0.6,"arousal":0.5,"primary_emotions":[{"emotion":"optimistic","intensity":0.7},{"emotion":"excited","intensity":0.5}],"secondary_emotions":[{"emotion":"surprised","intensity":0.4}],"emotional_triggers":[{"claim_id":"c2","emotion":"surprised","reason":"significant_positive_metric"}]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/5376f41e-b7ce-4940-8ce1-21914b94f45a.jpg","alt":"공항 터미널을 아이소메트릭으로 표현한 일러스트와 함께 'Research Inside 3D FeNAND Co-optimization' 문구가 담긴 IEEE 논문 소개 이미지.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting","research_paper"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":true,"full_text_access":null}}