{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"samsung-news_20260529_hbm4e-12-stack-sample-shipment","canonical_url":"https://news.samsung.com/kr/%ec%82%bc%ec%84%b1%ec%a0%84%ec%9e%90-%ec%84%b8%ea%b3%84-%ec%b5%9c%ec%b4%88-hbm4e-12%eb%8b%a8-%ec%83%98%ed%94%8c-%ec%b6%9c%ed%95%98","ai_url":null,"publisher":{"name":"삼성전자 뉴스룸","domain":"news.samsung.com","type":"corporate"},"author":"삼성전자 뉴스룸","published_at":"2026-05-29T08:14:22.000Z","updated_at":null,"language":"en","article_type":"press_release_based","originality":"self_produced"},"content":{"headline":"Samsung Electronics Ships World's First HBM4E 12-Layer Samples","summary":"Samsung Electronics announced that it has supplied the world's first HBM4E 12-layer samples, which will be key to next-generation AI accelerators, to global customers. The product features a speed improvement of over 20% compared to its predecessor, HBM4, and achieves a high capacity of 48GB.","topics":["semiconductors","ai","memory","technology"],"geography":["KR"],"entities":[{"name":"Samsung Electronics","canonical_id":"corp:kr:samsung-electronics","type":"company","role_in_article":"primary_subject","metadata":{"ticker":null,"parent":null}},{"name":"Hwang Sang-jun","canonical_id":"person:kr:hwang-sang-jun","type":"person","role_in_article":"quoted","metadata":{"ticker":null,"parent":null}}],"claims":[{"id":"c1","statement":"Supplied the world's first HBM4E 12-layer samples, which will be key to next-generation AI accelerators, to global customers","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c2","statement":"Successfully began mass production shipments of HBM4 with the industry's fastest speed last February","as_of":"2026-02","as_of_explicit":true,"as_of_raw":"last February","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c3","statement":"Per-pin operating speed supports up to 16Gbps, from 14Gbps","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c4","statement":"This represents a significant improvement of over 20% compared to the previous HBM4","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":"previous_generation","type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c5","statement":"Provides a bandwidth of 3.6TB per second on a single stack basis","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c6","statement":"The HBM4E 12-layer product achieves a high capacity of 48GB","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c7","statement":"Plans to thoroughly expand the lineup to 32GB (8-layer) and 64GB (16-layer) in the future to meet customers' diverse service environments","as_of":"2026","as_of_explicit":false,"as_of_raw":"going forward","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":null,"insight":null},{"id":"c8","statement":"Significantly improved energy efficiency by 16% and thermal resistance characteristics by over 14% compared to the previous generation","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":"previous_generation","type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c9","statement":"Plans to supply mass production according to customer schedules","as_of":"2026","as_of_explicit":false,"as_of_raw":"2026","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":null,"insight":null},{"id":"c10","statement":"Last December, Samsung Electronics' HBM4 proved industry-leading speed of 11.7Gbps in the SiP test, the final certification stage, receiving the top grade evaluation","as_of":"2025-12","as_of_explicit":true,"as_of_raw":"last December","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0,"arousal":0,"primary_emotions":[],"secondary_emotions":[],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/0762cc9f-197a-4931-b32b-84429dd3446d.jpg","alt":"삼성전자 반도체 공장 앞에 'HBM4E 샘플 출하' 배너와 탑차가 세워져 있다.","caption":null,"source":"first_img","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}