{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260722_research-inside-cti-3d-nand","canonical_url":"https://news.skhynix.co.kr/research-inside-ep1-02/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-07-22T05:00:57.000Z","updated_at":null,"language":"en","article_type":"press_release_based","originality":"self_produced"},"content":{"headline":"[Research Inside] Aiming for High-Performance, Ultra-High-Layer 3D NAND... CTI Innovation Technology Expanding from Research to Mass Production","summary":"SK hynix is expanding CTI (Contact Trench Isolation) technology from the research stage to mass production in order to realize ultra-high-layer 3D NAND flash. This innovative technology is expected to serve as a key element in the manufacturing of high-performance memory semiconductors.","topics":["semiconductors","3D NAND","CTI technology","mass production"],"geography":["KR"],"entities":[{"name":"SK hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}},{"name":"CTI","canonical_id":"product:kr:contact-trench-isolation","type":"product","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}},{"name":"3D NAND","canonical_id":"product:kr:3d-nand-flash","type":"product","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}}],"claims":[{"id":"c1","statement":"SK hynix is expanding its CTI (Contact Trench Isolation) innovation technology from the research stage to mass production, aiming for high-performance, ultra-high-layer 3D NAND flash","as_of":"2026-07","as_of_explicit":false,"as_of_raw":"July 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0.4,"arousal":0.3,"primary_emotions":[{"emotion":"optimistic","intensity":0.5}],"secondary_emotions":[{"emotion":"calm","intensity":0.4}],"emotional_triggers":[{"claim_id":"c1","emotion":"optimistic","reason":"major_opportunity"}]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/4d22d51f-47ce-4b22-acd3-e9f2ccadb0e0.jpg","alt":"기존 CTI 공정의 5단계 제조 과정을 보여주는 3D 낸드 구조 단면도, 포켓 형성부터 CTN 증착까지의 순서도.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"archival","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}