{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260928_tsmc-oip-conference-2026","canonical_url":"https://news.skhynix.co.kr/tsmc-oip-conference-2026/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"news.skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-09-28T05:23:28.000Z","updated_at":null,"language":"en","article_type":"straight_news","originality":"self_produced"},"content":{"headline":"“Behind AI’s Rapid Growth Lies Memory”… SK hynix Shares Next-Generation Memory Portfolio at ‘TSMC OIP Conference’","summary":"SK hynix unveiled its next-generation memory portfolio at the TSMC OIP Conference and received the ‘Partner of the Year Award’ from TSMC for the second consecutive year. It also forecast that the PCIe-based eSSD market would grow about 3.8-fold by 2030.","topics":["semiconductors","ai","memory","hbm","tsmc"],"geography":["KR","US"],"entities":[{"name":"SK hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}},{"name":"TSMC","canonical_id":"corp:tw:tsmc","type":"company","role_in_article":"mentioned","metadata":{"ticker":"2330.TW","parent":null}},{"name":"NVIDIA","canonical_id":"corp:us:nvidia","type":"company","role_in_article":"mentioned","metadata":{"ticker":"NVDA","parent":null}},{"name":"Cadence","canonical_id":"corp:us:cadence","type":"company","role_in_article":"mentioned","metadata":{"ticker":"CDNS","parent":null}},{"name":"Park Dae-sik","canonical_id":"person:kr:park-dae-sik","type":"person","role_in_article":"quoted","metadata":{"ticker":null,"parent":null}},{"name":"Park Jin-woo","canonical_id":"person:kr:park-jin-woo","type":"person","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}},{"name":"Lee Jae-sik","canonical_id":"person:kr:lee-jae-sik","type":"person","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}}],"claims":[{"id":"c1","statement":"SK hynix received the ‘Partner of the Year Award’ from TSMC for the second consecutive year","as_of":"2026-09","as_of_explicit":false,"as_of_raw":"on the 23rd","source_type":"company_disclosure","comparison":null,"type":"fact","figures":{"value":2,"unit":"years","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c2","statement":"SK hynix has participated in the TSMC OIP Conference since 2024","as_of":"2024","as_of_explicit":true,"as_of_raw":"since 2024","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c3","statement":"The PCIe-based eSSD market is expected to grow about 3.8-fold from 509EB in 2026 to 1,933EB in 2030","as_of":"2026","as_of_explicit":true,"as_of_raw":"2026","source_type":"company_plan","comparison":"previous_year_same_period","type":"estimate","figures":{"value":1933,"unit":"EB","approximate":false,"converted":null},"expiry_hint":"2030-12","insight":{"analyst_name":"박대식","analyst_affiliation":"SK하이닉스","confidence":"medium","forecast_horizon":"2030","sentiment":"bullish","reasoning":"Increased demand driven by the expansion of AI infrastructure"}},{"id":"c4","statement":"SK hynix is preparing chiplet-based next-generation SSD solutions for 6th and 7th generation PCIe","as_of":"2026","as_of_explicit":false,"as_of_raw":"this year","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":"2027-12","insight":null},{"id":"c5","statement":"SK hynix was recognized for its collaborative achievement in verifying HBM5 based on TSMC’s CoWoS","as_of":"2026","as_of_explicit":false,"as_of_raw":"this year","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0.4,"arousal":0.3,"primary_emotions":[{"emotion":"optimistic","intensity":0.7}],"secondary_emotions":[{"emotion":"calm","intensity":0.4}],"emotional_triggers":[{"claim_id":"c3","emotion":"optimistic","reason":"major_opportunity"}]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/006dd398-e208-4836-a98e-6919ee8a0d58.jpg","alt":"SK하이닉스가 'TSMC OIP 컨퍼런스'에 마련한 전시 부스로, HBM과 GPU 모형 등 차세대 메모리 제품이 전시되어 있다.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}