{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260608_hbm-future-talent-class","canonical_url":"https://news.skhynix.co.kr/%eb%af%b8%eb%9e%98%ec%9d%b8%ec%9e%ac-class-%ec%a0%9c1%ea%b0%95-hbm%ec%9d%98-%ea%b2%bd%ec%9f%81%eb%a0%a5-%eb%81%8c%ec%96%b4%ec%98%ac%eb%a6%b0-%ec%b0%a8%ec%84%b8%eb%8c%80-%ea%b8%b0%ec%88%a0%ec%9d%80/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"news.skhynix.co.kr","type":"corporate"},"author":"unknown","published_at":"2026-06-08T06:17:09.556Z","updated_at":null,"language":"en","article_type":"feature","originality":"self_produced"},"content":{"headline":"[Future Talent CLASS Lecture 1] What Next-Generation Technology Boosted HBM's Competitiveness?!","summary":"SK Hynix has released content introducing the next-generation technology that enhanced HBM's competitiveness, as the first lecture in its Future Talent CLASS series.","topics":["semiconductors","memory","HBM","technology"],"geography":["KR"],"entities":[{"name":"SK Hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":"corp:kr:sk-group"}}],"claims":[],"ai_emotional_context":{"valence":0.2,"arousal":0.3,"primary_emotions":[{"emotion":"optimistic","intensity":0.4}],"secondary_emotions":[],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/4d186575-b978-4cf5-85ed-468f261d3c6f.jpg","alt":"MR-MUF에 이어 HBM 경쟁력을 높일 차세대 기술을 소개하는 반도체 적층 구조 그래픽과 '미래인재 CLASS' 강의 안내 화면.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}