{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20261021_ai-ecosystem-semiconductor-paradigm-shift","canonical_url":"https://news.skhynix.co.kr/ai-ecosystem-series-ep4-2/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"news.skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-10-21T00:19:34.000Z","updated_at":null,"language":"en","article_type":"feature","originality":"self_produced"},"content":{"headline":"[AI Ecosystem] The Shift in the Semiconductor Paradigm: Toward Memory-Centricity","summary":"The fourth installment of the AI Ecosystem series examines how the semiconductor industry's paradigm is shifting toward memory-centric computing.","topics":["semiconductors","memory","ai"],"geography":["KR"],"entities":[{"name":"SK Hynix","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}}],"claims":[],"ai_emotional_context":{"valence":0,"arousal":0.1,"primary_emotions":[{"emotion":"indifferent","intensity":0.5}],"secondary_emotions":[],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/85a97921-06e2-4541-b736-a78d1e92513c.jpg","alt":"HBM과 컴퓨트 다이를 연결하는 하이브리드 본딩 구조를 기존 마이크로범프 접합과 비교한 반도체 패키징 설명도.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"breaking","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}