{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"tech42_20260525_huawei-chip-technology-tau-scaling","canonical_url":"https://www.tech42.co.kr/%ed%99%94%ec%9b%a8%ec%9d%b4-%eb%af%b8-%ec%a0%9c%ec%9e%ac-%ec%9a%b0%ed%9a%8c-%ec%b9%a9-%ea%b8%b0%ec%88%a0-%ea%b3%b5%ea%b0%9c%eb%a1%9c%ec%a7%81%ed%8f%b4%eb%94%a9%ec%9c%bc%eb%a1%9c/?utm_source=rss&utm_medium=rss&utm_campaign=%25ed%2599%2594%25ec%259b%25a8%25ec%259d%25b4-%25eb%25af%25b8-%25ec%25a0%259c%25ec%259e%25ac-%25ec%259a%25b0%25ed%259a%258c-%25ec%25b9%25a9-%25ea%25b8%25b0%25ec%2588%25a0-%25ea%25b3%25b5%25ea%25b0%259c%25eb%25a1%259c%25ec%25a7%2581%25ed%258f%25b4%25eb%2594%25a9%25ec%259c%25bc%25eb%25a1%259c","ai_url":null,"publisher":{"name":"테크42","domain":"tech42.co.kr","type":"online"},"author":"버트","published_at":"2026-05-25T23:32:26.000Z","updated_at":null,"language":"en","article_type":"straight_news","originality":"self_produced"},"content":{"headline":"Huawei Unveils Chip Technology to Circumvent US Sanctions... \"Logic Folding Improves Density by 53%\"","summary":"Huawei has unveiled new semiconductor technologies to circumvent US sanctions: the 'Tau Scaling Law' and 'Logic Folding' design approach. With this technology, they improved density by 53.5% and presented plans to achieve 400+ MTr/mm² by 2031.","topics":["semiconductor","technology","huawei","us-china conflict"],"geography":["CN","US"],"entities":[{"name":"Huawei","canonical_id":"corp:cn:huawei","type":"company","role_in_article":"primary_subject","metadata":{"ticker":null,"parent":null}},{"name":"IEEE","canonical_id":"org:us:ieee","type":"organization","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}},{"name":"Kirin","canonical_id":"product:cn:kirin","type":"product","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}},{"name":"DGA Group","canonical_id":"corp:us:dga-group","type":"company","role_in_article":"source","metadata":{"ticker":null,"parent":null}},{"name":"Paul Triolo","canonical_id":"person:us:paul-triolo","type":"person","role_in_article":"quoted","metadata":{"ticker":null,"parent":null}}],"claims":[{"id":"c1","statement":"Huawei has designed and mass-produced 381 chips for smartphones and AI based on the Tau Scaling Law over the past 6 years","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"over the past 6 years","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c2","statement":"Logic folding increased transistors per mm² by 53.5% compared to the previous generation, reaching 238 MTr/mm²","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":"previous_generation","type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c3","statement":"Transistor density per mm² reached 238 MTr/mm²","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c4","statement":"Performance core power efficiency improved by 41%","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c5","statement":"Maximum clock speed improved by 12.7%, reaching approximately 3.1 GHz","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"May 2026","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c6","statement":"Kirin smartphone chip will be released this fall","as_of":"2026-05","as_of_explicit":false,"as_of_raw":"this fall","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":null,"insight":null},{"id":"c7","statement":"Will achieve density equivalent to 1.4nm process (400+ MTr/mm²) by 2031","as_of":"2031","as_of_explicit":true,"as_of_raw":"by 2031","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0,"arousal":0,"primary_emotions":[],"secondary_emotions":[],"emotional_triggers":[]}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}