{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260803_hbf-standard-fms2026","canonical_url":"https://news.skhynix.co.kr/hbf-at-fms-2026/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"news.skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-08-03T23:30:03.000Z","updated_at":null,"language":"en","article_type":"press_release_based","originality":"self_produced"},"content":{"headline":"SK Hynix Unveils First HBF Standard Specification with SanDisk…Shares AI Memory Solutions at 'FMS 2026'","summary":"SK Hynix, together with SanDisk, unveiled the first standard specification for the next-generation storage technology HBF through OCP. The company also unveiled its 10th-generation 375-layer 4D NAND for the first time at the FMS 2026 event and announced plans to begin mass production of eSSDs based on it in early next year.","topics":["semiconductors","AI infrastructure","memory technology","standardization","SK Hynix"],"geography":["KR","US"],"entities":[{"name":"SK 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