{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"삼성전자뉴스룸_20261101_yokohama-ap-lab","canonical_url":"https://news.samsung.com/kr/%EC%9D%B4%EC%9E%AC%EC%9A%A9-%EC%82%BC%EC%84%B1%EC%A0%84%EC%9E%90-%ED%9A%8C%EC%9E%98-%EB%AF%B8%EB%9E%98-%EB%B0%98%EB%8F%84%EC%B2%B4-%ED%8C%A8%ED%82%A4%EC%A7%95-%EA%B8%B0%EC%88%80-%EC%9D%BC%EB%B3%BB","ai_url":null,"publisher":{"name":"삼성전자 뉴스룸","domain":"https://news.samsung.com/kr/","type":"online"},"author":"삼성전자 뉴스룸","published_at":"2026-11-01T16:21:41.000Z","updated_at":null,"language":"en","article_type":"straight_news","originality":"self_produced"},"content":{"headline":"Samsung Electronics Chairman Lee Jae-yong Inspects Future Semiconductor Packaging Technology in Japan","summary":"Samsung Electronics Chairman Lee Jae-yong visited the 'Advanced Package Lab (APL),' an advanced semiconductor packaging research base in Yokohama, Japan, on the 1st to review the status of next-generation packaging technology. Samsung Electronics is strengthening its research foundation in Japan by investing ¥40 billion over five years starting in 2024.","topics":["economy","semiconductors"],"geography":["KR","JP"],"entities":[{"name":"Samsung Electronics","canonical_id":"corp:kr:samsung-electronics","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"005930.KS","parent":null}}],"claims":[{"id":"c1","statement":"Samsung Electronics is building its research foundation in Japan by investing ¥40 billion (approximately ₩350 billion) over five years starting in 2024.","as_of":"2024","as_of_explicit":false,"as_of_raw":"starting in 2024","source_type":"company_plan","comparison":null,"type":"future_plan","figures":{"value":40000000000,"unit":"KRW","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c2","statement":"In 2023, the company established APL in Yokohama for research on packaging elemental technologies.","as_of":"2023","as_of_explicit":true,"as_of_raw":"in 2023","source_type":"company_disclosure","comparison":null,"type":"fact","figures":{"value":0,"unit":"","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c3","statement":"APL is Samsung Electronics' packaging research base in Japan, which officially opened on September 8.","as_of":"2025-09","as_of_explicit":false,"as_of_raw":"September 8","source_type":"company_disclosure","comparison":null,"type":"fact","figures":{"value":0,"unit":"","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c4","statement":"Chairman Lee discussed with APL researchers the status of advanced packaging materials and process technology development as well as cooperation plans with Japan's materials, parts, and equipment industry, and emphasized securing advanced packaging technology, which is key to semiconductor competitiveness in the AI era.","as_of":"2026-11","as_of_explicit":false,"as_of_raw":"on the 1st","source_type":"media_report","comparison":null,"type":"fact","figures":{"value":0,"unit":"","approximate":false,"converted":null},"expiry_hint":null,"insight":null},{"id":"c5","statement":"Samsung Electronics plans to continuously expand its local research workforce to develop Yokohama into a global R&D hub for next-generation packaging elemental technology development.","as_of":"2026-11","as_of_explicit":false,"as_of_raw":"continuously expanding","source_type":"media_report","comparison":null,"type":"fact","figures":{"value":0,"unit":"","approximate":false,"converted":null},"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0.3,"arousal":0.4,"primary_emotions":[{"emotion":"optimistic","intensity":0.5},{"emotion":"hopeful","intensity":0.5}],"secondary_emotions":[{"emotion":"calm","intensity":0.5}],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/62199bfb-c280-4432-a0ea-526f1fa18613.jpg","alt":"이재용 삼성전자 회장이 일본 연구소 실험실에서 관계자 설명을 들으며 반도체 패키징 장비를 살펴보고 있다.","caption":null,"source":"first_img","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}