{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20261021_ai-ecosystem-semiconductor-paradigm-shift","canonical_url":"https://news.skhynix.co.kr/ai-ecosystem-series-ep4-1/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"news.skhynix.co.kr","type":"online"},"author":"unknown","published_at":"2026-10-21T00:17:41.000Z","updated_at":null,"language":"ko","article_type":"feature","originality":"self_produced"},"content":{"headline":"[AI Ecosystem] 반도체 패러다임의 이동: 메모리 중심으로","summary":"AI 생태계 시리즈 4편으로, 반도체 산업의 패러다임이 메모리 중심으로 이동하고 있음을 다룬다.","topics":["반도체","메모리","AI"],"geography":["KR"],"entities":[{"name":"SK하이닉스","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":"000660.KS","parent":null}}],"claims":[],"ai_emotional_context":{"valence":0,"arousal":0.1,"primary_emotions":[{"emotion":"indifferent","intensity":0.5}],"secondary_emotions":[],"emotional_triggers":[]},"image":{"url":"https://onjblseywainslkhvkav.supabase.co/storage/v1/object/public/article-images/5f409c86-fc91-4f40-ad75-bbf47538fb31.jpg","alt":"기존 메모리 구조와 HBM 적용 AI 가속기 구조를 비교하며 TSV 적층 DRAM 다이 등 HBM 내부 구조를 설명하는 인포그래픽.","caption":null,"source":"og_image","alt_status":"auto"}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"breaking","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}