{"@context":"https://neupai.io/schema/v0.2","@type":"StructuredNewsArticle","identity":{"article_id":"skhynix_20260423_tsmc-symposium-memory-logic-integration","canonical_url":"https://news.skhynix.co.kr/tsmc-technology-symposium-2026/","ai_url":null,"publisher":{"name":"SK하이닉스 뉴스룸","domain":"news.skhynix.co.kr","type":"online"},"author":"SK하이닉스","published_at":"2026-04-23T06:41:35.000Z","updated_at":null,"language":"ko","article_type":"press_release_based","originality":"self_produced"},"content":{"headline":"기술 한계 극복 위해선, 메모리와 로직 통합 필요\"… SK하이닉스, TSMC 심포지엄서 비전 제시","summary":"SK하이닉스가 TSMC 테크놀로지 심포지엄 2026에서 메모리 병목 현상 해결을 위해 메모리와 로직 기술 통합의 필요성을 강조하며, HBM4부터 TSMC 로직 공정을 베이스다이에 도입하는 전략을 발표했다.","topics":["반도체","AI","메모리","HBM","기술협력"],"geography":["KR","US"],"entities":[{"name":"SK하이닉스","canonical_id":"corp:kr:sk-hynix","type":"company","role_in_article":"primary_subject","metadata":{"ticker":null,"parent":null}},{"name":"TSMC","canonical_id":"corp:tw:tsmc","type":"company","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}},{"name":"안현","canonical_id":"person:kr:ahn-hyun","type":"person","role_in_article":"quoted","metadata":{"ticker":null,"parent":null}},{"name":"엔비디아","canonical_id":"corp:us:nvidia","type":"company","role_in_article":"mentioned","metadata":{"ticker":null,"parent":null}}],"claims":[{"id":"c1","statement":"TSMC가 전 세계 7개 주요 거점 지역에서 개방형 혁신 플랫폼 포럼을 열고 있다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c2","statement":"TSMC가 3㎚를 넘어 2㎚, A16·A14 공정으로 이어지는 미세 공정 기술의 진전에 집중했다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c3","statement":"A16은 TSMC가 발표한 차세대 1.6㎚급 공정이다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c4","statement":"A14는 A16 이후 선보일 예정인 차세대 1.4㎚급 첨단 공정이다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":null,"insight":null},{"id":"c5","statement":"SK하이닉스가 HBM4부터 베이스다이에 TSMC의 선단 로직 공정을 도입하는 전략적 협업을 공고히 하겠다고 예고했다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_plan","comparison":null,"type":"future_plan","figures":null,"expiry_hint":null,"insight":null},{"id":"c6","statement":"HBM4 48GB 16단 제품이 전시되었다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c7","statement":"업계 최대 용량을 구현한 256GB 3DS RDIMM을 전시했다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c8","statement":"고성능 연산 환경에 최적화된 128GB MRDIMM을 전시했다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c9","statement":"세계 최초로 1c㎚ 공정을 적용해 전력 효율을 극대화한 64GB RDIMM을 전시했다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c10","statement":"새로운 폼팩터로 저전력 고성능을 실현한 192GB SOCAMM2를 AI 서버에 특화된 차세대 솔루션으로 선보였다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null},{"id":"c11","statement":"HBM3E 12단이 엔비디아 GB300 내부에 탑재되었다","as_of":"2026-04","as_of_explicit":false,"as_of_raw":"2026년 4월","source_type":"company_disclosure","comparison":null,"type":"fact","figures":null,"expiry_hint":null,"insight":null}],"ai_emotional_context":{"valence":0,"arousal":0,"primary_emotions":[],"secondary_emotions":[],"emotional_triggers":[]}},"provenance":{"source_chain":["primary_reporting"],"original_source_url":null,"related_articles":[]},"temporal":{"freshness":"recent","next_update_expected":null},"access":{"license":"neupai_standard","attribution_required":true,"structured_data":"free","full_text_available":false,"full_text_access":null}}